AMD Ryzen 8000 CPUs Coming in 2024 with Zen 5 Cores and RDNA 3.5 iGPU [Confirmed]

AMD plans to launch the Ryzen 8000 CPUs based on the Zen 5 core architecture in the second half of 2024. This was confirmed by a leaked slide detailing AMD’s desktop AM5 roadmap. The slide reiterates the chipmaker’s commitment to the AM5 platform, promising comprehensive support till 2026. As per the document, AMD will release next-generation Ryzen CPUs every year.

Source: @Harukaze.

Ergo, the Ryzen 8000 family will launch in the second half of 2024, just a year after the Ryzen 7000 lineup. In comparison, the Ryzen 7000 chips (Sep 2022) launched roughly two years after the first Ryzen 5000 parts (Nov 2020). Furthermore, these processors will have an upgraded graphics engine featuring the RDNA 3.5 microarchitecture.

According to Kepler (Twitter), RDNA 3.5 or gfx11.5 will integrate some of the features of RDNA 4. It packs the next-generation RDNA 4 SALU (scalar ALU) with support for FP32 instructions and an enhanced geometry engine. However, dGPU-centric changes like updated RT cores and a newer scheduler won’t be included.

Nothing else is mentioned in the slide beside the TDP ranges of the future chips and a renewed focus on efficiency. The higher-end CPUs will draw up to 230W (170W base), while the non-X variants will remain limited to 65W at base clocks.

We know that the Zen 5-based Ryzen 8000 processors will drastically change the core architecture. A revamped frontend, wider instruction issue, and integrated machine-learning instructions. The core counts are expected to stay the same, ranging from 6 on Ryzen 5 to 16 on the Ryzen 9 SKUs. The L2 cache will be doubled from 1MB to 2MB per core, bringing it to parity with Intel’s Raptor Cove design.

The other major change will come in the form of the inter-core fabric. Zen 5 will feature a unique core interconnect called Ladder L3 Fabric. In this topology, each core is directly connected to the opposite one. The adjacent cores are connected using a ladder-like common bus connected to an identical opposite bus via seven high-speed links. This topology should improve inter-core latency, bandwidth gaming performance, etc.

There have been confusing rumors about the Zen 5 process node. Multiple reports have stated that AMD has prepared the core for the TSMC N4 (4nm) and N3 (3nm) nodes. However, recently it has been disclosed by multiple sources that it will leverage the latter. The Ryzen 8000 CPUs leveraging the Zen 5 core should land in the second half of 2024, likely in Q3.

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Areej Syed

Processors, PC gaming, and the past. I have written about computer hardware for over seven years with over 5000 published articles. I started during engineering college and haven't stopped since. On the side, I play RPGs like Baldur's Gate, Dragon Age, Mass Effect, Divinity, and Fallout. Contact: areejs12@hardwaretimes.com.
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